BuiltWithNOF
PCB Assembley

Nova ETS   has many years of experience in PCB assembly (Printed Circuit Board  assembly) which comes from manufacturing PCB mounted EMI filters (RFI filters, EMC filters) for many of its customers. We expanded this capability by the introduction of two new  product lines; motor  controls and electronic controls. We also offer  our customers, electronic contract  manufacturing of fully assembled PCBs to their design (build to print).

Nova ETS Ltd offers PCB assembly  (Printed Circuit Board assembly) in large and small volumes with capability to assemble Thru-hole as well as Surface Mount (SMA) boards with 100% in-circuit testing if required.

We manufacture PCB  assemblies, electronic controls, and electronic motor controls at  our China facilities. In an effort to provide our mid to high volume  commercial customers more cost effective and competitive products LCR initiated  its China operations in 2001.

. Apart from manufacturing standard and custom EMI filters (RFI filters, EMC  filters), coils  & chokes, motor controls and electronic controls for our large volume commercial customers, LCR also utilizes its China facility for electronic contract  manufacturing and PCB assembly (Printed Circuit Board  assembly).

Nova ETS design and development resides at our China Plant, where all the design and documentation efforts are accomplished. The completed  documentation package along with samples is then sent to our "wholly owned" low cost China facility which builds the PCB assemblies based on the  specific instruction and documentation received from our US facility.  China facilities are ISO 9001-2000 approved.

The China facility starts  volumes production only after Nova ETS - UK as well as our customer has approved the  first article.

After the quality inspections at our China facility parts are  shipped to Nova ETS LTD -UK Office , where they go through another round of incoming quality. The parts are then shipped to our customer. Should our customer require it, we keep the parts in inventory at our UK facility  and ship them to the customer per their releases.

 We have developed viable component sources near our China facility for PCB assembly (Printed Circuit Board  assembly) applications and we can supply fully assembled PCBs quickly and cost effectively to your specifications.

Some of Nova ETS electronic contract manufacturing capabilities are:

  • Coil, choke &  inductor winding
  • PBC design (artwork)
  • Component sourcing
  • PCB stuffing
  • Wave soldering
  • Encapsulation
  • Conformal coating
  • Can fabrication
  • Motor Controls and Electronic Controls assembly
  • Wire Harness assembly and integration
  • Thru-Hole and Surface Mount PCB assembly
  • Vertically integrated - allowing quick delivery on custom jobs to meet your  most stringent needs.

    • Expertise
    • Technology leadership
    • Cost-effective
    • Focus on Lean principles and continuous improvement
    • Environmental legislation compliance know-how
    • Flexibility
    • Scalability
    • Proficiency in streamlining your manufacturing infrastructure

    Our integrated services and solutions support all stages of the product  lifecycle. With superior project management capabilities, Celestica provides a  complete range of electronics manufacturing services and solutions for a vast  range of products and market sectors.

    Tailored Electronic Manufacturing Solutions

    As a leading provider of Printed Circuit Assembly (PCA), Celestica offers customers a full range of assembly services, including:

    • Low-volume prototyping
    • Low-volume high-mix
    • Highly complex medical equipment
    • Communications and computing products
    • High-volume/low-mix consumer electronics

    With facilities located strategically throughout Asia, Europe and the  Americas, our global manufacturing network provides our customers with  manufacturing solutions that are flexible, cost-effective and scalable.

    Full PCA Technology Capabilities

    Driven by the skills of our global network of engineering experts, we provide:

    • Optimized test development and support that considers all aspects of test, including failure analysis
    • Data management
    • Competitive test cost, quality and availability
    • Services including flying probe, optical and X-ray inspection (AOI and AXI), in-circuit test (ICT) and functional test (FT) development
    • Assembly processes that assist you in meeting the requirements of emerging environmental legislation

    We combine advanced processes with highly skilled resources. Our innovative  techniques extend to sophisticated packaging and assembly technology, including:

    • Tin-lead and lead-free SMT and Wave
    • CCGA to 2577 I/O
    • PBGA to 2916 I/O
    • CSP to 0.5mm pitch
    • Discretes down to 0201s
    • Double-sided/mirrored BGA assembly
    • Double-sided/single reflow processing
    • Fine pitch, high pin count, press fit connectors
    • Fine pitch, high-speed, SMT connectors
    • Optical fiber splicing, assembly and cable management